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DGAP-News: Micron's Hybrid Memory Cube Wins The Linley Group Analysts' Choice Award (deutsch)

Veröffentlicht am 25.01.2012, 19:00
Micron's Hybrid Memory Cube Wins The Linley Group Analysts' Choice Award

Micron Technology, Inc.

25.01.2012 19:00

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Best Technology' Pairs Memory With Processors to Enable Several Near-Term and

Future Markets

BOISE, Idaho, Jan. 25, 2012 (GLOBE NEWSWIRE) -- Micron (Nasdaq:MU) announced

today that its Hybrid Memory Cube (HMC) was chosen as a winner of The Linley

Group's first annual Analysts' Choice Awards. The Hybrid Memory Cube won the

award for Best Technology of 2011.

The Analysts' Choice Awards recognize the top microprocessor-related products

of 2011 in several major categories, including embedded, mobile, PC, server,

design IP and related technologies. For the Best Technology Award, The Linley

Group's team of technology analysts considered merits of the leading,

forward-looking technologies that were announced during 2011.

'Our analysts are deeply familiar with processor products and technology,

having conducted extensive research in order to deliver the firm's popular

publications and reports,' said Linley Gwennap, founder and principal analyst

at The Linley Group. 'We chose the winners on the basis of their performance,

power, features and cost, as appropriate for their target applications.'

'Hybrid Memory Cubes promise greater density, lower latency, higher bandwidth,

and better power efficiency per bit compared with conventional memories,' said

Tom R. Halfhill, a senior analyst at The Linley Group. 'Early benchmarks show a

memory cube blasting data 12 times faster than DDR3-1333 SDRAM while using only

about 10 percent of the power.'

HMC technology uses advanced through-silicon vias (TSVs) -- vertical conduits

that electrically connect a stack of individual chips -- to combine

high-performance logic with Micron's state-of-the-art DRAM. HMC delivers

bandwidth and efficiencies a leap beyond current device capabilities. HMC

prototypes, for example, clock in with bandwidth of 128 gigabytes per second

(GB/s). By comparison, current state-of-the-art devices deliver 12.8 GB/s. HMC

also requires 70 percent less energy to transfer data while offering a small

form factor-- just 10 percent of the footprint of conventional memory.

HMC will enable a new generation of performance in applications ranging from

large-scale networking and high-performance computing, to industrial automation

and, eventually, consumer products.

'With so many other great innovations out there, we're especially honored to

receive this prestigious award from The Linley Group. This world-class

recognition is a reflection on the team that is working to match processors

with memory and break down the memory wall by bringing the Hybrid Memory Cube

to the market,' said Brian Shirley, vice president for Micron's DRAM Solutions

Group. 'Special thanks to the Micron engineers who've designed this

breakthrough architecture, and to our esteemed colleagues in the industry who

are helping to expedite the specifications and manufacturing for this

revolutionary technology.'

The Linley Group has initiated the awards program to honor excellence in

processor design and innovation and to recognize the processor products it

believes will have the greatest impact on next-generation system design. The

Linley Group publishes Microprocessor Report, the industry's leading

newsletter, and other technology reports. For more information about this

award, please visit: www.linleygroup.com

Additional information, technical specifications, tools and support for

adopting HMC technology can be found at micron.com.

Relevant Links

Stay up-to-date on Micron news with these easy tools:

-- Micron Innovations Blog: www.micronblogs.com



-- Micron on Twitter: http://twitter.com/microntechnews



-- Micron Pressroom: www.micron.com/media

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced

semiconductor solutions. Through its worldwide operations, Micron manufactures

and markets a full range of DRAM, NAND and NOR flash memory, as well as other

innovative memory technologies, packaging solutions and semiconductor systems

for use in leading-edge computing, consumer, networking, embedded and mobile

products. Micron's common stock is traded on the NASDAQ under the MU symbol. To

learn more about Micron Technology, Inc., visit www.micron.com.

The Micron Technology, Inc. logo is available at

http://www.globenewswire.com/newsroom/prs/?pkgid=6950

(c)2012 Micron Technology, Inc. All rights reserved. Information is subject to

change without notice. Micron and the Micron orbit logo are trademarks of

Micron Technology, Inc. All other trademarks are the property of their

respective owners.

CONTACT: Scott Stevens

Micron Technology, Inc.

512-288-4050

sstevens@micron.com

News Source: NASDAQ OMX

25.01.2012 Dissemination of a Corporate News, transmitted by DGAP -

a company of EquityStory AG.

The issuer is solely responsible for the content of this announcement.

DGAP's Distribution Services include Regulatory Announcements,

Financial/Corporate News and Press Releases.

Media archive at www.dgap-medientreff.de and www.dgap.de

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Language: English

Company: Micron Technology, Inc.





United States

Phone:

Fax:

E-mail:

Internet:

ISIN: US5951121038

WKN:



End of Announcement DGAP News-Service



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