Microsoft Joins Hybrid Memory Cube Consortium, Which Aims to Break Down Memory Wall
Micron Technology, Inc.
08.05.2012 16:00
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BOISE, Idaho and SAN JOSE, Calif., 2012-05-08 16:00 CEST (GLOBE NEWSWIRE) --
The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc.
(Nasdaq:MU), and Samsung Electronics Co., Ltd., today announced that Microsoft
Corp. has joined the consortium. The HMCC is a collaboration of original
equipment manufacturers (OEMs), enablers and integrators who are cooperating to
develop and implement an open interface standard for an innovative new memory
technology called the Hybrid Memory Cube (HMC). Micron and Samsung, the initial
developing members of the HMCC, are working closely with Altera, IBM,
Open-Silicon, Xilinx and now Microsoft to accelerate widespread industry
adoption of HMC technology.
The technology will enable highly efficient memory solutions for applications
ranging from industrial products to high-performance computing and large-scale
networking. The HMCC's team of developers plans to deliver a draft interface
specification to a growing number of 'adopters' that are joining the
consortium. Then, the combined team of developers and adopters will refine the
draft and release a final interface specification at the end of this year.
Adopter membership in the HMCC is available to any company interested in
joining the consortium and participating in the specification development. The
HMCC has responded to interest from more than 75 prospective adopters.
As envisioned, HMC capabilities will leap beyond current and near-term memory
architectures in the areas of performance, packaging and power efficiencies,
offering a major shift from present memory technology. By opening new doors for
developers, manufacturers and architects, the consortium is committed to making
HMC a new standard in high-performance memory technology.
'HMC technology represents a major step forward in the direction of increasing
memory bandwidth and performance, while decreasing the energy and latency
needed for moving data between the memory arrays and the processor cores, '
said KD Hallman, General Manager of Microsoft Strategic Software/Silicon
Architectures. 'Harvesting this solution for various future systems could lead
to better and/or novel digital experiences.'
One of the primary challenges facing the industry -- and a key motivation for
forming the HMCC -- is that the memory bandwidth required by high-performance
computers and next-generation networking equipment has increased beyond what
conventional memory architectures can provide. The term 'memory wall' has been
used to describe this dilemma. Breaking through the memory wall requires
architecture such as the HMC that can provide increased density and bandwidth
at significantly reduced power consumption.
Additional information, technical specifications, tools and support for
adopting the technology can be found at www.hybridmemorycube.org.
About the HMCC
Founded by leading members of the world's semiconductor community, the Hybrid
Memory Cube Consortium (HMCC) is dedicated to the development and establishment
of an industry-standard interface specification for the Hybrid Memory Cube
technology. Members of the consortium presently include Micron, Samsung,
Altera, Open-Silicon, Xilinx, IBM and Microsoft. More than75 prospective
adopters are exploring consortium membership. To learn more about the HMCC,
visit www.hybridmemorycube.org.
Scott Stevens
Micron Technology, Inc.
+1.512.288.4050
sstevens@micron.com
John Lucas
Samsung Electronics Co., Ltd.
408-544-4363
j.lucas@ssi.samsung.com
News Source: NASDAQ OMX
08.05.2012 Dissemination of a Corporate News, transmitted by DGAP -
a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
---------------------------------------------------------------------------
Language: English
Company: Micron Technology, Inc.
United States
Phone:
Fax:
E-mail:
Internet:
ISIN: US5951121038
WKN:
End of Announcement DGAP News-Service
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Micron Technology, Inc.
08.05.2012 16:00
---------------------------------------------------------------------------
BOISE, Idaho and SAN JOSE, Calif., 2012-05-08 16:00 CEST (GLOBE NEWSWIRE) --
The Hybrid Memory Cube Consortium (HMCC), led by Micron Technology, Inc.
(Nasdaq:MU), and Samsung Electronics Co., Ltd., today announced that Microsoft
Corp. has joined the consortium. The HMCC is a collaboration of original
equipment manufacturers (OEMs), enablers and integrators who are cooperating to
develop and implement an open interface standard for an innovative new memory
technology called the Hybrid Memory Cube (HMC). Micron and Samsung, the initial
developing members of the HMCC, are working closely with Altera, IBM,
Open-Silicon, Xilinx and now Microsoft to accelerate widespread industry
adoption of HMC technology.
The technology will enable highly efficient memory solutions for applications
ranging from industrial products to high-performance computing and large-scale
networking. The HMCC's team of developers plans to deliver a draft interface
specification to a growing number of 'adopters' that are joining the
consortium. Then, the combined team of developers and adopters will refine the
draft and release a final interface specification at the end of this year.
Adopter membership in the HMCC is available to any company interested in
joining the consortium and participating in the specification development. The
HMCC has responded to interest from more than 75 prospective adopters.
As envisioned, HMC capabilities will leap beyond current and near-term memory
architectures in the areas of performance, packaging and power efficiencies,
offering a major shift from present memory technology. By opening new doors for
developers, manufacturers and architects, the consortium is committed to making
HMC a new standard in high-performance memory technology.
'HMC technology represents a major step forward in the direction of increasing
memory bandwidth and performance, while decreasing the energy and latency
needed for moving data between the memory arrays and the processor cores, '
said KD Hallman, General Manager of Microsoft Strategic Software/Silicon
Architectures. 'Harvesting this solution for various future systems could lead
to better and/or novel digital experiences.'
One of the primary challenges facing the industry -- and a key motivation for
forming the HMCC -- is that the memory bandwidth required by high-performance
computers and next-generation networking equipment has increased beyond what
conventional memory architectures can provide. The term 'memory wall' has been
used to describe this dilemma. Breaking through the memory wall requires
architecture such as the HMC that can provide increased density and bandwidth
at significantly reduced power consumption.
Additional information, technical specifications, tools and support for
adopting the technology can be found at www.hybridmemorycube.org.
About the HMCC
Founded by leading members of the world's semiconductor community, the Hybrid
Memory Cube Consortium (HMCC) is dedicated to the development and establishment
of an industry-standard interface specification for the Hybrid Memory Cube
technology. Members of the consortium presently include Micron, Samsung,
Altera, Open-Silicon, Xilinx, IBM and Microsoft. More than75 prospective
adopters are exploring consortium membership. To learn more about the HMCC,
visit www.hybridmemorycube.org.
Scott Stevens
Micron Technology, Inc.
+1.512.288.4050
sstevens@micron.com
John Lucas
Samsung Electronics Co., Ltd.
408-544-4363
j.lucas@ssi.samsung.com
News Source: NASDAQ OMX
08.05.2012 Dissemination of a Corporate News, transmitted by DGAP -
a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
---------------------------------------------------------------------------
Language: English
Company: Micron Technology, Inc.
United States
Phone:
Fax:
E-mail:
Internet:
ISIN: US5951121038
WKN:
End of Announcement DGAP News-Service
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