Micron and Samsung Launch Consortium to Break Down the Memory Wall
Micron Technology, Inc.
06.10.2011 21:00
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Joint Effort Intended to Accelerate Hybrid Memory Cube Interface Adoption,
Enable Rapid Pace of Technology Advancements and Future Generations of
Electronics
BOISE, Idaho and SEOUL, Korea, Oct. 6, 2011 (GLOBE NEWSWIRE) -- Samsung
Electronics Co., Ltd. and Micron Technology, Inc. (Nasdaq:MU), -- world leaders
in memory technology -- today announced the creation of a consortium for OEMs,
enablers and integrators that will collaborate in developing and implementing
an open interface specification for an innovative new memory technology called
the Hybrid Memory Cube (HMC).
Micron and Samsung are the founding members of the Hybrid Memory Cube
Consortium (HMCC), and will work closely with fellow developers Altera
Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate
industry efforts in bringing to market a broad set of technologies. The
consortium will initially define a specification to enable applications ranging
from large-scale networking to industrial products and high-performance
computing.
One of the primary challenges facing the industry -- and a key motivation for
forming the HMCC -- is that the memory bandwidth required by high-performance
computers and next-generation networking equipment has increased beyond what
conventional memory architectures can provide. The term 'memory wall' has been
used to describe the problem. Breaking through the memory wall requires a new
architecture that can provide increased density and bandwidth at significantly
reduced power consumption.
HMC capabilities are a leap beyond current and near-term memory architectures
in the areas of performance, packaging and design efficiencies. By defining an
industry interface specification for developers, manufacturers and architects,
the consortium is committed to making HMC a successful new high-performance
memory technology.
'This collaborative industry effort will serve as an accelerator for highly
promising technology that will benefit the entire industry,' said Jim Elliott,
Vice President, Memory Marketing and Product Planning, Samsung Semiconductor,
Inc. 'The consortium will help to bring about a game-changing system solution
for system designers and manufacturers that is expected to outperform memory
options offered today.'
HMC could lead to unprecedented levels of memory performance and facilitate new
applications in networking, medical, energy, wireless communications,
transportation, security and other markets. For example, the development of
systems and technologies will enable a more efficient, reliable and secure
smart grid infrastructure with integrated renewable energy resources.
'HMC is unlike anything currently on the radar,' said Robert Feurle, Micron's
Vice President for DRAM Marketing. 'HMC brings a new level of capability to
memory that provides exponential performance and efficiency gains that will
redefine the future of memory. Guidance by the industry consortium will help
drive the fastest possible adoption of the technology, resulting in what we
believe will be radical improvements to computing systems.'
The HMCC's memory specifications will be co-developed among the consortium
members. The consortium is open to an unlimited number of adopters, with the
opportunity to receive early access to draft specifications and participate in
specification discussions and development. Additional information, technical
specifications, tools and support for adopting the technology can be found at
www.hybridmemorycube.org.
About the HMCC
Founded by leading members of the world's semiconductor community, the Hybrid
Memory Cube Consortium (HMCC) is dedicated to the development of an industry
interface specification for the Hybrid Memory Cube technology. Members of the
consortium presently include Micron Technology, Samsung Electronics, Altera
Corporation, Open Silicon, Inc., and Xilinx, Inc., with additional companies in
discussion to join. To learn more about the HMCC, visit
www.hybridmemorycube.org.
(c)2011 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice. Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners.
Samsung and the stylized Samsung design are trademarks and service marks of
Samsung Electronics Co., Ltd. Other trademarks are the property of their
respective owners.
The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950
CONTACT: Micron:
Scott Stevens
+1.512.288.4050
sstevens@micron.com
Samsung:
In U.S.
John Lucas, APR
Samsung Semiconductor, Inc.
408-544-4363
j.lucas@ssi.samsung.com
Outside U.S.
Sunghae Park
Samsung Electronics
+82-31-209-7037
sunghae_park@samsung.com
News Source: NASDAQ OMX
06.10.2011 Dissemination of a Corporate News, transmitted by DGAP -
a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
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Language: English
Company: Micron Technology, Inc.
United States
Phone:
Fax:
E-mail:
Internet:
ISIN: US5951121038
WKN:
End of Announcement DGAP News-Service
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Micron Technology, Inc.
06.10.2011 21:00
---------------------------------------------------------------------------
Joint Effort Intended to Accelerate Hybrid Memory Cube Interface Adoption,
Enable Rapid Pace of Technology Advancements and Future Generations of
Electronics
BOISE, Idaho and SEOUL, Korea, Oct. 6, 2011 (GLOBE NEWSWIRE) -- Samsung
Electronics Co., Ltd. and Micron Technology, Inc. (Nasdaq:MU), -- world leaders
in memory technology -- today announced the creation of a consortium for OEMs,
enablers and integrators that will collaborate in developing and implementing
an open interface specification for an innovative new memory technology called
the Hybrid Memory Cube (HMC).
Micron and Samsung are the founding members of the Hybrid Memory Cube
Consortium (HMCC), and will work closely with fellow developers Altera
Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate
industry efforts in bringing to market a broad set of technologies. The
consortium will initially define a specification to enable applications ranging
from large-scale networking to industrial products and high-performance
computing.
One of the primary challenges facing the industry -- and a key motivation for
forming the HMCC -- is that the memory bandwidth required by high-performance
computers and next-generation networking equipment has increased beyond what
conventional memory architectures can provide. The term 'memory wall' has been
used to describe the problem. Breaking through the memory wall requires a new
architecture that can provide increased density and bandwidth at significantly
reduced power consumption.
HMC capabilities are a leap beyond current and near-term memory architectures
in the areas of performance, packaging and design efficiencies. By defining an
industry interface specification for developers, manufacturers and architects,
the consortium is committed to making HMC a successful new high-performance
memory technology.
'This collaborative industry effort will serve as an accelerator for highly
promising technology that will benefit the entire industry,' said Jim Elliott,
Vice President, Memory Marketing and Product Planning, Samsung Semiconductor,
Inc. 'The consortium will help to bring about a game-changing system solution
for system designers and manufacturers that is expected to outperform memory
options offered today.'
HMC could lead to unprecedented levels of memory performance and facilitate new
applications in networking, medical, energy, wireless communications,
transportation, security and other markets. For example, the development of
systems and technologies will enable a more efficient, reliable and secure
smart grid infrastructure with integrated renewable energy resources.
'HMC is unlike anything currently on the radar,' said Robert Feurle, Micron's
Vice President for DRAM Marketing. 'HMC brings a new level of capability to
memory that provides exponential performance and efficiency gains that will
redefine the future of memory. Guidance by the industry consortium will help
drive the fastest possible adoption of the technology, resulting in what we
believe will be radical improvements to computing systems.'
The HMCC's memory specifications will be co-developed among the consortium
members. The consortium is open to an unlimited number of adopters, with the
opportunity to receive early access to draft specifications and participate in
specification discussions and development. Additional information, technical
specifications, tools and support for adopting the technology can be found at
www.hybridmemorycube.org.
About the HMCC
Founded by leading members of the world's semiconductor community, the Hybrid
Memory Cube Consortium (HMCC) is dedicated to the development of an industry
interface specification for the Hybrid Memory Cube technology. Members of the
consortium presently include Micron Technology, Samsung Electronics, Altera
Corporation, Open Silicon, Inc., and Xilinx, Inc., with additional companies in
discussion to join. To learn more about the HMCC, visit
www.hybridmemorycube.org.
(c)2011 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice. Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners.
Samsung and the stylized Samsung design are trademarks and service marks of
Samsung Electronics Co., Ltd. Other trademarks are the property of their
respective owners.
The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950
CONTACT: Micron:
Scott Stevens
+1.512.288.4050
sstevens@micron.com
Samsung:
In U.S.
John Lucas, APR
Samsung Semiconductor, Inc.
408-544-4363
j.lucas@ssi.samsung.com
Outside U.S.
Sunghae Park
Samsung Electronics
+82-31-209-7037
sunghae_park@samsung.com
News Source: NASDAQ OMX
06.10.2011 Dissemination of a Corporate News, transmitted by DGAP -
a company of EquityStory AG.
The issuer is solely responsible for the content of this announcement.
DGAP's Distribution Services include Regulatory Announcements,
Financial/Corporate News and Press Releases.
Media archive at www.dgap-medientreff.de and www.dgap.de
---------------------------------------------------------------------------
Language: English
Company: Micron Technology, Inc.
United States
Phone:
Fax:
E-mail:
Internet:
ISIN: US5951121038
WKN:
End of Announcement DGAP News-Service
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